|
|
Building a A new manufacturing process that permits integration of sensor and signal conditioning electronics on a single IC die can help accelerometers detect even smaller signals.
Harvey Weinberg, Analog Devices Inc. Surface micromachining permits the moving acceleration sensor element and all the signal conditioning electronics to be integrated on the same IC die. The single-die approach yields small, low-cost sensors; tight integration of the sensor and signal conditioning is the key to high performance. The ADXL202E accelerometer, an inexpensive, surface micromachined 50 mm3 accelerometer, is capable of measuring both static (gravitational force) and dynamic (vibration and shock) accelerations.
Sensor Structure The entire IC (mechanical and electronic elements) is built in a standard BiMOS IC process. The main difference between building a surface micromachined accelerometer and a conventional BiMOS op-amp is the number of steps performed in the manufacturing process.
Figure 1 shows the basic process steps for building the freestanding mechanical elements on the ADXL202.
Look closely at the geometry of each set of fingers in Figure 3. The differential capacitance of each is proportional to the overlapping area between the fixed outer plates and the moving finger, and the displacement of the moving finger. Because these are very small capacitors, you need the largest practical differential capacitance to reduce noise and increase resolution.
The finger height (3 microns for the example product) is fixed by process technology, while the overlap (125 microns here) is adjustable to some extent. Longer fingers are not desirable, however, because they are harder to manufacture and result in larger beam areas, which in turn translates to more expensive parts. The movement of the beam is controlled by polysilicon springs, and obeys the basic laws of physics:
Therefore,
where:
The only two parameters under your control are the spring constant and the mass. Reducing the spring constant seems like an easy way to improve beam sensitivity, but, as usual, nothing comes for free. The resonant frequency of the beam is proportional to the spring constant:
and the bandwidth of the accelerometer must not extend to the resonant frequency. In addition, higher spring constants make for more rugged beams that can survive greater shocks. So if the ideal is to keep the spring constant as high as possible, the only parameter left to change is the mass. Adding mass normally implies a larger sensor area, which results in more expensive parts because the only way to add mass is to make the beam larger. The ADXL202's beam structure, however, interleaves the X and Y axis beams, resulting in a reduction of the overall sensor area with added beam mass enhancing the unit's resolution.
Signal Conditioning
When the movable fingers (and hence the beam) are centered between the fixed outer plates, both sides of the differential capacitor have equal capacitance and the AC voltage on the beam is zero. If the beam is displaced by an applied acceleration, however, the differential capacitance becomes unbalanced, resulting in an AC voltage with an amplitude proportional to the displacement of the beam. This AC voltage is amplified and then demodulated by a synchronous demodulator. Figure 5 shows the overall circuit architecture.
Notice that the output of the demodulator drives the duty cycle modulator through a 32 k
Performance and Applications
In fact, the ADXL202E's combination of low cost and high performance acceleration/tilt sensing capabilities has opened the door to several nontraditional accelerometer applications. The unit is currently in use in applications such as car alarms (for jacking or towing sensing), pen-based handwriting recognition systems, portable electronic games, and wearable sports equipment. Harvey Weinberg is an Applications Engineer, Analog Devices Inc., Micromachined Products Group, 21 Osborn St., Cambridge, MA 02139; 617-761-7644, fax 617-761-7607, harvey.weinberg@analog.com. |
|
|